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model:PT-V2400

Silicon nitride vacuum sintering furnace

Application

Detailed Parameters of the Product

Introduction

This PT‑V2400 silicon nitride sintering furnace is specially designed for vacuum sintering and partial pressure sintering of semiconductor ceramic products. It adopts a specialized furnace structure and optimized heater layout to ensure outstanding temperature uniformity. The furnace supports multiple working modes including vacuum sintering, partial pressure sintering, negative pressure debinding sintering, and micro positive pressure sintering. It is equipped with over-temperature, over-pressure fault alarms, mechanical automatic pressure protection and interlock functions to ensure high safety. An optional degreasing system is available to realize one‑step debinding and sintering. The precise gas charging and discharging system allows accurate flow adjustment, and the horizontal moving material cart facilitates convenient loading and unloading.

Applications

1. Vacuum sintering and partial pressure sintering of silicon nitride ceramics
2. High‑temperature sintering of semiconductor ceramic components
3. Integrated debinding and sintering of advanced ceramic products
4. High‑precision thermal treatment of ceramic materials for electronic and semiconductor industries
5. Vacuum and atmosphere sintering of high‑performance structural ceramics

silicon nitride vacuum sinteirng furnace

Model	Effective heating area size (width * height * depth/mm)	Maximum temperature (℃)	Ultimate vacuum (pa)	Temperature uniformity (℃)	Pressure rise rate (Pa/h)	Loading capacity (kg)
PT-V2400-12W	200200300	2400	≤5Pa	±5	≤0.67	30
PT-V2400-36W	300300400	2400	≤5Pa	±5	≤0.67	50
PT-V2400-96W	400400600	2400	≤5Pa	±5	≤0.67	120
PT-V2400-175W	500500700	2400	≤5Pa	±5	≤0.67	200
PT-V2400-324W	600600900	2400	≤5Pa	±5	≤0.67	300

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No. 104, building 31, Xingyang equipment manufacturing industrial park, Zhengzhou City,
Henan Province, China
Zhengzhou Protech Technology Co., Ltd
郑州诺泰科技有限公司

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