At present, the equipment can be used for gallium arsenide, silicon and other semiconductor materials, annealing after ion implantation, formation of silicide, ohmic contact preparation, rapid oxidation, rapid nitridation, etc. Bell jar furnace is mainly composed of vacuum chamber, heating chamber, air inlet system, vacuum system, temperature control system, air cooling system, water cooling system, etc. Let's understand the functions of the following components:
1. Vacuum chamber: The vacuum chamber is its working space, where the wafer is subject to rapid heat treatment.
2. Heating chamber: The heating chamber uses multiple infrared lamps as heating elements, high-temperature resistant alloy as the frame, and high-purity quartz as the main body.
3. Air inlet system: there is an air inlet at the end of the vacuum chamber, and the controlled air intake is used to meet the gas demand of some special processes.
4. Vacuum system: A high vacuum solenoid valve is installed between the vacuum pump and the vacuum chamber, which can effectively ensure the vacuum degree of the chamber, and at the same time prevent the gas from backpouring to pollute the processed workpiece in the chamber.
5. Temperature control system: The temperature control system consists of temperature sensor, temperature controller, power regulator, programmable controller, PC and various sensors.
6. Air cooling system: The cooling of the vacuum chamber is to fill the chamber with inert gas through the air inlet system to accelerate the cooling of the workpiece to be heat treated to meet the process requirements.
7. Water cooling system: mainly includes cooling water for vacuum chamber, heating chamber and sealing rings at various parts.
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