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The development source of chemical vapor deposition CVD

Today Nuotai Technology will briefly share with you the development sources of chemical vapor deposition CVD.
chemical vapor deposition CVD
   Vapor Deposition in Chemical Vapor Deposition in English (Chemical Vapor Deposition) means vapor deposition, which means the use of physical and chemical processes occurring in the vapor phase to form deposits on the solid surface. According to the mechanism, it can be divided into three categories: Physical Vapor Deposition (PVD), Chemical Vapor Deposition (CVD) and Plasma Chemical Vapor Deposition (PCVD). At present, CVD is the most widely used, and its technological development and research are also the most mature. It is widely used for purifying substances and preparing various single crystal, polycrystalline or glassy inorganic thin film materials.

   Below we will mainly look at the difference between CVD and PVD. The chemical reaction in the CVD deposition process is a vapor phase chemical growth process, which specifically refers to the process of using gaseous or vaporous substances to chemically react on the solid surface to generate solid deposits. In short, it is the process of introducing a variety of gaseous materials into the reaction chamber, causing them to chemically react with each other to generate new materials, and finally depositing on the surface of the substrate body.

   At present, CVD technology has played a huge role in the electronics, machinery and other industrial sectors, especially for the deposition of functional films and superhard films such as oxides, carbides, diamonds and diamond-like carbon. Especially at present, the production of ultra-pure silicon raw material-ultra-pure polysilicon can only be done through CVD technology.


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