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model:SYJ-150

Digital Low Speed Diamond Saw with Three 4＂ Precision Blad

temperature:
- 1200
- 1400
- 1700
chamber size:

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Detailed Parameters Of The Product

Application:
SYJ-150 is CE certified low speed diamond saw , which equips with advanced digital micrometer and digital speed display controller, it is the perfect tool for cutting/dicing/slicing all kinds of materials up to 25 mm thickness, especially for brittle crystals, ceramics, TEM samples, and even plastic samples.

Technical parameters:

Voltage and Power	AC 110V/220V switchable for worldwide usage 70W Max. Power consuming
Speed range	Variable 0-600 rpm with LED digital display
Cutting Width	The cutting width of the slice is controllable from 1mm ~ 24mm by adjusting the LCD digital micrometer. The LCD micrometer is water-proof with resolution of 0.001 mm and accuracy of +/-0.003 mm.
Cutting Depth	55mm max. cutting depth (when using 25mm dia. blade flange) Please click the pic below to know the cutting depth
Diamond Blades	Three blades are included for cutting various materials SiC blade: 4" x 0.35 mm x 0.5" arbor for cutting nonferrous metal materials, such as super-alloys. Al2O3 blade: 4" x 0.35 mm x 0.5" arbor for cutting ferrous metal materials, such as iron and steel. Full sintered diamond blade: 4" x 0.35 mm x 0.5" arbor for cutting crystal, ceramic, and plastic materials
Sample holder & Mini-vise	Two angle adjustable sample holder is included, please click picture below for the details One Mini-vise is included, which can be easily adapted onto the sample holder to clamp rod shape specimens with diameter upto 1'' max.
Package dimensions	19"(L) x 15"(W) x 15"(H)
Shipping weight	32 lbs
Warranty	Two years limited with life time support (not including rusted parts due to inadequate storage conditions)
Certification	CE Certified
Application Notes	Must use anti-corrosion coolant during cutting to avoid rusting the lead screw. Please never use water as coolant during cutting. Always clean machine, especially the lead screw by WD40 lubricant after each use.