Detailed Parameters Of The Product
Application:
EQ-UNIPOL-1502machine equips with 14 -15" diameter super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, and ceramic substrates up to 4" diameter with three work stations. It also can be adopted a standard grinding and polishing machine for preparing metallographic samples.
Technical parameters:
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Two Super Flat Lapping Plate |
Flatness< 0.25 micron / Inch |
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Precision Rotating Shaft |
Running off < 5 micron |
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Features |
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One cast iron plate for lapping and one cast aluminum plate for polishing
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Heavy duty cast aluminum case with bright painting
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Three rocking work stations with wafer holders and condition rings.
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They can be controlled independently for polishing 3 pcs of 4" wafers or 9 pcs of 2" wafers in one running
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Adjustable Timer for Auto-stop |
0~99 hours |
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Variable Speed |
0 to 80 RPM with digital display |
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Compliance |
CE Certified |
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Warranty |
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One year limited warranty with lifetime support
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Rusting and damage due to improper storage condition or maintenance is not covered by warranty
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